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Features
Linear Formula: | MoCu |
Appearance: | Metallic solid |
Shape: | Sheet, Plate, Rod, Bar or Customized |
Molybdenum Copper Alloy Description
Molybdenum copper alloy is a pseudo-alloy made of copper and molybdenum that do not solidify with each other. Copper clad molybdenum performs both advantages of copper and molybdenum which is highly oxidation and corrosion-resistant, performing well in high-temperature applications.
Molybdenum copper is one of the numerous metal alloys sold by SSC. SSC's alloy products are available in various forms such as powder, bars, ingots, ribbons, wires, sheets, sputtering targets, foils, and custom shapes in both standard and customer-specified element compositions. Our engineers can provide guidance in selecting an alloy based on intended application. Please request a quote above to receive pricing information based on your specifications.
We produce a wide range of molybdenum alloy mill products using powder metallurgy (PM) method. The availability of products from this process gives users many options in selecting a material to satisfy their specific application requirements. Mo alloy mill products are available from either process include forging billets, bar, rod, sheet, plate and foil. All forms in basically the same size range as pure molybdenum with the exception of thin foil.
Coefficient of thermal expansion (CTE) of copper molybdenum can be tailored by adjusting the composition, which is the same way with tungsten copper composites. MoCu is much lighter than tungsten cooper, which make it more suitable for aerospace usage.
The most important usage of copper molybdenum is heat sinks for electronic devices. Besides MoCu and WCu (tungsten copper) heat sinks, we can also provide pure molybdenum, Cu-Mo-Cu heat sinks, Mo-Cu-Mo parts, Cu-MoCu-Cu parts and Mo-CuMo-Mo parts.
Mo-Cu Heat Sinks Specification
Physical Properties | Mo85Cu15 | Mo80Cu20 | Mo70Cu30 | Mo60Cu40 | Mo50Cu50 |
Composition (wt% Mo Cu: balance) | 85% | 80% | 70% | 60% | 50% |
Density at 20°C (g/cm3) | 10.0 | 9.9 | 9.8 | 9.6 | 9.5 |
CTE at 20°C (10-6/K) | 6.8 | 7.2 | 9.1 | 10.3 | 11.5 |
Thermal Conductivity (W/mK) | 165 | 175 | 195 | 215 | 250 |
Specific Heat at 100°C (J/kgK) | 275 | - | 301 | 310 | 323 |
Electrical Conductivity at 20°C (MS/m) | 18.5 | 19.8 | 22.3 | 24.8 | 27.3 |
Young's Modulus at 20°C (Gpa) | 248 | 241 | 225 | - | 172 |
Flexural Strength (MPa) | 1,138 | 1,103 | - | - | - |
Vicker's Hardness (HV 10) | - | - | 170 | - | 150 |
Cu-Mo-Cu (CMC) Heat Sinks Specification
Cu: Mo: Cu (Thick ratio) | Density (g/cc) | Coefficient of Thermal Expansion (10-6/K) | Thermal Conductivity (W/m·K), x-y direction | Thermal Conductivity (W/m·K), x-z direction |
1:1:1 | 9.4 | 9.4 | 300~310 | 240~250 |
1:2:1 | 9.6 | 7.7 | 260~270 | 210~220 |
1:3:1 | 9.7 | 6.9 | 230~240 | 190~200 |
1:4:1 | 9.8 | 6.2 | 210~220 | 170~180 |
13:74:13 | 9.9 | 5.8 | 190~200 | 160~170 |
Cu-Mo70Cu-Cu (CPC) Heat Sinks Specification
Cu-Mo70Cu-Cu (Thick ratio) | Density (g/cc) | Coefficient of Thermal Expansion (10-6/K) | Thermal Conductivity (W/m·K) | ||
Plate direction | Thick direction | Plate direction | Thick direction | ||
1:4:1 | 9.46 | 7.2 | 9.0 | 250-300 | 210-250 |
Molybdenum Copper Alloy Applications and Related Industries
● Vacuum contacts
● Conductive heat dissipation components
● Instrumentation components
● Rockets that are used at a slightly lower temperature
● High-temperature components of missiles and components in other weapons such as range extenders
● Solid sealing
● Sliding friction reinforcing ribs
● Water-cooled electrode heads in high-temperature furnaces
● Electro-machined electrodes
● Metallurgy
● Aerospace
● Research & Laboratory
Chemical Identifiers
Linear Formula | MoCu |
MDL Number | N/A |
EC No. | N/A |
Pubchem CID | 57448858 |
IUPAC Name | copper; molybdenum |
SMILES | [Cu].[Mo] |
InchI Identifier | InChI=1S/Cu.Mo |
InchI Key | WUUZKBJEUBFVMV-UHFFFAOYSA-N |
Molybdenum Copper Alloy Properties (Theoretical)
Compound Formula | MoCu |
Molecular Weight | 159.496 |
Appearance | Metallic solid in various forms (plate, sheet, pieces, custom parts) |
Melting Point | N/A |
Boiling Point | N/A |
Density | 9.3-10.0 g/cm3 |
Solubility in H2O | N/A |
Electrical Resistivity | 3.8 x 10-6 Ω·cm |
Thermal Conductivity | 195-250 W/m·K |
Thermal Expansion | 6.8-10.3 µm/m-°C |
Exact Mass | 160.835 g/mol |
Monoisotopic Mass | 160.835 g/mol |
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