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Features
CAS No.: | 7440-74-6 |
Linear Formula: | In |
Purity: | 99% - 99.999% |
Appearance: | Silvery metallic solid |
Shape: | Foil, Sheet, Strip, Ribbon |
Thickness: | 0.05-10mm |
Width: | 10-500mm |
Length: | 10-10,000mm |
Indium Foil Description
Indium foil is a type of advanced engineering that uses indium's special properties to solve many different industrial problems. Indium is the 61st most common element and is low in toxicity and very malleable. Its melting temperature is 157°C. It can move easily even at very low temperatures, which makes it very important for use in cryogenics. Indium has a high boiling point of 2080°C, which makes it useful for many different things.
The malleability of indium foil and its cold soldering abilities make it a good choice for gaskets and seals. It easily fits on surfaces that touch each other, which makes it good at transferring heat, especially in the electronics industry. Also, indium's low vapor pressure makes it good for high-vacuum environments.
In the semiconductor industry, indium is used to make semiconductor materials, especially thin-film solar cells. This material is used to make electrodes for touchscreens and liquid crystal displays. It has clear and conductive coatings. Indium oxide and indium tin oxide coatings are used to make electroluminescent panels. It's good at sealing things in vacuum systems, and it can stick to things better in acoustic transducers.
Indium foil and sheet are excellent heat sinks for both high-temperature and cryogenic applications. It's useful in many different areas, like electronics and renewable energy.
Indium Foil Applications and Related Industries
● Gaskets and seals
● Thermal interface
● Making alloys
● Semiconductor
● Extremely efficient heat sink for high temperature and cryogenic applications
● Art and design
● Aerospace
● Defense
● High Purity Materials
● Research & Laboratory
Chemical Identifiers
Linear Formula | In |
MDL Number | MFCD00134048 |
EC No. | 231-180-0 |
Beilstein/Reaxys No. | N/A |
Pubchem CID | 5359967 |
SMILES | [In] |
InchI Identifier | InChI=1S/In |
InchI Key | APFVFJFRJDLVQX-UHFFFAOYSA-N |
Indium Foil Properties (Theoretical)
Molecular Weight | 114.82 |
Appearance | solid |
Melting Point | 156.6 °C |
Boiling Point | 2080 °C |
Density | 7310 kg/m3 |
Solubility in H2O | N/A |
Electrical Resistivity | 8.37 microhm-cm @ 20 °C |
Electronegativity | 1.7 Paulings |
Heat of Fusion | 0.781 Cal/gm mole |
Heat of Vaporization | 53.7 K-Cal/gm atom at 2080 °C |
Poisson's Ratio | 0.4498 |
Specific Heat | 0.056 Cal/g/K @ 25 °C |
Tensile Strength | N/A |
Thermal Conductivity | 0.818 W/cm/K @ 298.2 K |
Thermal Expansion | (25 °C) 32.1 µm·m-1·K-1 |
Vickers Hardness | <10 |
Young's Modulus | 11 GPa |
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