Moly Copper

Introduction to Molybdenum Copper and Copper Clad Molybdenum

Molybdenum Copper

Molybdenum copper (MoCu) is a material that combines copper and molybdenum to conduct heat well. At our manufacturing facility, we offer a range of molybdenum copper materials, including plates, sheets, foils, rods, and machined parts, with the most common ratios of 70/30 and 80/20. Also, we have different ratios of Mo and Cu: 50:50, 60:40, and 85:15. Our molybdenum copper sheets and foils have thicknesses ranging from 3 to less than 0.002 inches, while our rods and wires have diameters ranging from 0.01 to 10.0 inches or more.

The thermal conductivity of molybdenum copper is 170-300 W/mK, while the electrical conductivity is 38-66 IACS % Min. The coefficient of thermal expansion (CTE) is 6.8-12.8 10-6/K and the density is 9.2-10.0 g/cm3. MoCu's efficient thermal conductivity and coefficient of thermal expansion (CTE) match those of electronic components. Molybdenum copper is a good material for heat sinks and other baseplates used in IGBT, LDMOS, and GaN/GaAs-based devices.

Molybdenum copper materials have CTEs that range from 5.610-6 K to 11.510-6 K. Molybdenum copper composites can have a similar CTE to Al2O3, BeO, AlN, and SiC. The combination of CTEs can reduce thermal stresses, which makes electronic components more reliable and last longer.

Molybdenum copper is very good at spreading heat, which is important for heat sinks and heat spreaders in high-power and high-frequency electronics. For example, MoCu composites with 15% to 18% copper, like Mo75Cu25, can conduct heat as high as 160 Wm-1 K-1. Molybdenum copper has a lower specific density and better machineability than copper tungsten composite materials. These two advantages are very important for devices that need to be light and have integrated electronics.

Molybdenum copper is good for vacuum environments because it doesn't emit gases as fast as other metals. It's simple to get rid of things like Mo and Cu oxides and other things like N2, H2, and C.

Molybdenum copper is an excellent material for heat sinks and heat spreaders because of its excellent heat dissipation, electrical transmission, weight sensitivity, and machinability. Our company is a leading molybdenum copper materials supplier, and we pride ourselves on being able to offer our customers high-quality molybdenum copper materials that meet their specific needs. Please contact us today to learn more about our products.

Copper Clad Molybdenum

MoCu Laminates, also called Copper Clad Molybdenum, are made up of different combinations of Mo/MoCu and Cu. They are used a lot in high-speed and powerful machines because they have good heat properties. In this article, we will talk about the different MoCu Laminates and their properties.

MoCu Laminates come in three types: CMC, CPC, and SCMC.

CMC is a three-layer material made of molybdenum and copper. It has two outer copper layers and one inner molybdenum layer. This three-layer structure can have different thickness ratios, like 1:1, 1:2, 1:3, and 1:4. CMC has a density range of 9.3 to 9.88 g/cm3. Its thermal conductivity range is 170-300 W/mK. It can conduct electricity at 101.3 IACS % Min and has a range of 5.6-12.8 10-6/K.

The CPC is a copper-molybdenum copper-copper laminated structure. The material in CPC's core is changed from pure molybdenum to molybdenum copper, which has 15% to 40% copper in it. CPC 141 is the most common CPC model and has a Mo70Cu30 core layer and 1:4:1 thickness ratio. CPC has a density of 9.1 to 9.54 grams per square meter and a thermal conductivity of 220-255 Watts per square kilometer. Electrical conductivity is 101.3 IACS % Min and the CTE range is 8.4-11.5 10-6/K.

SCMC is made up of five layers of molybdenum and copper. There are two molybdenum core layers and three copper layers. SCMC has a density range of 9.1 to 9.4 grams per cubic meter and a thermal conductivity range of 190-220 W/mK. It can conduct electricity and has a CTE range of 7.2-8.5 10-6/K.

Copper Clad Molybdenum is a structure made by rolling-bonding multiple layers of Mo/MoCu and Cu materials to exact thickness ratios. The layers must not be more than 10% different in thickness from the specifications. All interfaces of molybdenum copper laminates must be clear and flat to prevent damaging cracking or flaking. The outer layer of copper is good at transferring heat and keeping it warm. The layer of molybdenum between the copper layers keeps the thickness of the laminate in the right range for what it's meant for.

Copper Clad Molybdenum is used in high-frequency and high-power applications because it has a good thermal conductivity. MoCu Laminates are used in microwave carriers, heat sinks, semiconductor devices, high-speed computers, and the aerospace industry.

To sum up, Copper Clad Molybdenum or MoCu Laminates have many layers of different Mo/MoCu and Cu combinations. They are available in three models, including the CMC, CPC and SCMC. These laminates have excellent thermal and electrical conductivity, a low thermal expansion coefficient, high-temperature strength, and good mechanical properties, which make them ideal for various high-performance applications.

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